Broadcom has unveiled the first-ever 3.5D F2F technology for AI XPUs. Takeaway points Broadcom unveils first-ever 3.5D F2F technology for AI XPUs. The 3.5D XDSiP combines more than 6000 mm² of silicon and up to 12 high-bandwidth memory (HBM) stacks in one packaged device to enable high-efficiency, low-power computing for AI at scale. With more […]

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